Force Sensors for Microelectronic Packaging Applications [E-Book] / by Jürg Schwizer, Michael Mayer, Oliver Brand.
This monograph is intended for wire bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors. New measurement technologies are introduced that allow in situ and real-time examination of physical processes during the packaging proc...
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Full text |
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Personal Name(s): | Schwizer, Jürg. author |
Brand, Oliver. author / Mayer, Michael. author | |
Imprint: |
Berlin, Heidelberg :
Springer,
2005
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Physical Description: |
VIII, 178 p. online resource. |
Note: |
englisch |
ISBN: |
9783540269458 |
DOI: |
10.1007/b138345 |
Series Title: |
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Microtechnology and MEMS
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Subject (LOC): |
- Sensor Design
- Measurement System
- Characterization
- Applications
- Conclusions and Outlook.