Carius, R., Merdzhanova, T., Finger, F., Klein, S., & Vetterl, O. (2003). A comparison of microcrystalline silicon prepared with plasma-enhanced chemical vapor deposition and hot-wire chemical vapor deposition: Electronic and device properties. Dordrecht [u.a.]: Springer Science + Business Media B.V.

Carius, R., T. Merdzhanova, F. Finger, S. Klein, andfavorite O. Vetterl. A Comparison of Microcrystalline Silicon Prepared With Plasma-enhanced Chemical Vapor Deposition and Hot-wire Chemical Vapor Deposition: Electronic and Device Properties. Dordrecht [u.a.]: Springer Science + Business Media B.V, 2003.

Carius, R., et al. A Comparison of Microcrystalline Silicon Prepared With Plasma-enhanced Chemical Vapor Deposition and Hot-wire Chemical Vapor Deposition: Electronic and Device Properties. Dordrecht [u.a.]: Springer Science + Business Media B.V, 2003.