This title appears in the Scientific Report : 2003 

Spread of critical currents in thin-film YBa2Cu3O7-x bicrystal junctions and faceting of grain boundary
Shadrin, P.
Jia, C. L. / Divin, Y.
Mikrostrukturforschung; IFF-IMF
IEEE transactions on applied superconductivity, 13 (2003) S. 603 - 605
New York, NY IEEE 2003
603 - 605
10.1109/TASC.2003.813959
Journal Article
Kondensierte Materie
IEEE Transactions on Applied Superconductivity 13
J
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Please use the identifier: http://dx.doi.org/10.1109/TASC.2003.813959 in citations.
Please use the identifier: http://hdl.handle.net/2128/1063 in citations.
The statistical distributions of critical currents in series arrays of YBa2Cu3O7-x grain-boundary junctions have been studied by Low-Temperature Laser Scanning Microscopy. A set of arrays has been fabricated on (110) NdGaO3 bicrystal substrates with misorientation angles from 2 x 10degrees up to 2 x 26degrees and patterned to the widths from 1.7 up to 5 micrometers. The critical current values of the individual junctions in the array have been obtained by focusing a laser beam on each junction and measuring the bias current at which the maximum laser-induced voltage response has appeared on the array. The measured critical current distributions have been demonstrated to be close to a log-normal Gauss function. A spread of this distribution has been found to increase with a bicrystal angle. YBa2Cu3O7-x grain-boundary topography has been studied by Atomic Force Microscopy. From results of these measurements we suppose that the maximum values of critical current density might be assigned to the symmetrical facets of grain boundary.