This title appears in the Scientific Report :
2006
Please use the identifier:
http://dx.doi.org/10.1016/j.mee.2005.12.023 in citations.
Protected Nanoelectrodes of two different Metals with 30 nm Gap-width and Access-window
Protected Nanoelectrodes of two different Metals with 30 nm Gap-width and Access-window
Reproducible fabrication of 30 nm metallic nanogaps on silicon chips and their electrochemical characterization are presented. The fabrication of the chip is a combination of an optical lithography step and two electron-beam (e-beam) steps. An optimized adhesion layer/metal layer combination (Ti/Pt/...
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Personal Name(s): | Kronholz, S. |
---|---|
Karthäuser, S. / Meszaros, G. / Wandlowski, Th. / Van Der Hart, A. / Waser, R. | |
Contributing Institute: |
Institut für Grenzflächen und Vakuumtechnologien; ISG-3 Institut für Bio- und Chemosensoren; ISG-2 Center of Nanoelectronic Systems for Information Technology; CNI Elektronische Materialien; IFF-IEM JARA-FIT; JARA-FIT |
Published in: | Microelectronic engineering, 83 (2006) S. 1702 - 1705 |
Imprint: |
[S.l.] @
Elsevier
2006
|
Physical Description: |
1702 - 1705 |
DOI: |
10.1016/j.mee.2005.12.023 |
Document Type: |
Journal Article |
Research Program: |
Grundlagen für zukünftige Informationstechnologien |
Series Title: |
Microelectronic Engineering
83 |
Subject (ZB): | |
Publikationsportal JuSER |
Reproducible fabrication of 30 nm metallic nanogaps on silicon chips and their electrochemical characterization are presented. The fabrication of the chip is a combination of an optical lithography step and two electron-beam (e-beam) steps. An optimized adhesion layer/metal layer combination (Ti/Pt/Au) and an adopted two layer e-beam resist are used. Specifically the chip has been covered with different protection layers, access windows located on top of the nanogaps, calibration electrodes and contact pads, respectively. After characterization of the gaps and of the protection layer in 0.1 M H2SO4 aqueous electrolyte, the deposition of Cu onto the nanogaps was demonstrated successfully. (c) 2006 Elsevier B.V. All rights reserved. |