Dasgupta, A., Huang, Y., Houben, L., Klein, S., Finger, F., Carius, R., & Luysberg, M. (2008). Effect of filament and substrate temperatures on the structural and electrical properties of SIC thin films grown by the HWCVD technique. Amsterdam [u.a.]: Elsevier.

Dasgupta, A., Y. Huang, L. Houben, S. Klein, F. Finger, R. Carius, andfavorite M. Luysberg. Effect of Filament and Substrate Temperatures On the Structural and Electrical Properties of SIC Thin Films Grown By the HWCVD Technique. Amsterdam [u.a.]: Elsevier, 2008.

Dasgupta, A., et al. Effect of Filament and Substrate Temperatures On the Structural and Electrical Properties of SIC Thin Films Grown By the HWCVD Technique. Amsterdam [u.a.]: Elsevier, 2008.