Einfluß von Passivierung und von Legierungszusätzen auf die thermischen Spannungen von Leiterbahnen in integrierten Schaltkreisen
Nielen, H. (Corresponding author)
Publikationen vor 2000; PRE-2000; Retrocat
Jülich Forschungszentrum Jülich, Zentralbibliothek, Verlag 1998
V, 133 p.
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Book
ohne Topic
Berichte des Forschungszentrums Jülich 3601
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Please use the identifier: http://hdl.handle.net/2128/22641 in citations.

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245 |a Einfluß von Passivierung und von Legierungszusätzen auf die thermischen Spannungen von Leiterbahnen in integrierten Schaltkreisen 
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520 |a Mechanical stress and electromigration effects become of increasing concern with continuing miniaturization. After processing at elevated temperatures, where a nearly stress free stete in the metallization is assumed, and cooling down to room temperature high thermal strains remain in the metal lines due to the thermal expansion mismatch between the metallization an the one hand side and the substrate and the passivation on the other. Due to the relaxation of these stresses plastic deformation such as creep flow and stiess voiding is very important for reliability concerns because it often leads to resistanee increase or complete line failure e.g. when the void diameter reaches a major pari of the live dimensions. X-ray diffraction technique is used in this work to measure the mean strain in an array of parallel passivated lines. Different aluminum alloys, passivation materials and passivation geometries are investigated during thennal cycles. All samples show a strong <111>-texture that seems to be present independent of the samples shape, i .e., in a blanket film or in patterned lines. The amount of copper in the aluminum lattice has a small but noticeable influence on the texture i.e. the texture formation is less distinct for an increasing amount of copper. The strains and stresses in the metal lines during thermal cycling are mainly influenced by the elastic behavior of the passivation but not by the alloy composition of the metallization. A stiffer passivation induces higher thermal stresses in the metallization than a softer. For example, thehigher Young's-modulus of siliconnitride compared to siliconoxide and also an increasing passivation thickness result in higher metal stresses. A planarized passivation behaves in the crossdirection (which is now filled up with passivation material) much stiffer than a passivation with a conformal shape. Finite element method (leEM) calculations give information about the pure elastic reaction of the metallization on temperature ehanges. By combining these results and the measured x-ray data within the so-called theory of eigenstrains, data for volumetric changes (voiding) and also for (volume preserving) plastic shear deformation in the lines can be determined during thermal cycling. The results of all different samples show only small but no significant variations in theeigenstrains during the thermal cycles. Therefore, the plastie shear deformation is nearly the same for all samples. No distinct correlation between the voiding and the hydrostatic stress in the metal lines, $\sigma_{hydr}$, could be found. For most of the samples the voiding during cycling is nearly zero within the experimental resolution. Especially, the sample with the lowest ahydr shows a slightly higher amount of voiding compared to other samples with significantly higher $\sigma_{hydr}$. These results imply the supposition that other parameters than the metal $\sigma_{hydr}$ are mainly responsible for the amount of voiding damage in the metallization. Different passivation materials are produced by different deposition techniques and different chemistry resulting in different interfaces and possibly different interface contaminations. lt seems to be mueh more important to better control these chemical parameters during passivation deposition because those factors may reduce the void nucleation barrier at the metal-passivation interface which is known as the exclusive void nucleation site. 
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