This title appears in the Scientific Report :
2008
Please use the identifier:
http://dx.doi.org/10.1149/1.2982883 in citations.
Strained Silicon on Wafer Level by Wafer Bonding: Materials Processing, Strain Measurements and Strain Relaxation
Strained Silicon on Wafer Level by Wafer Bonding: Materials Processing, Strain Measurements and Strain Relaxation
Saved in:
Personal Name(s): | Reiche, M. |
---|---|
Moutanabir, O. / Himcinschi, C. / Christiansen, S. / Erfurth, W. / Gösele, U. / Mantl, S. / Buca, D. / Zhao, Q. T. / Loo, R. / Nguyen, D. / Muster, F. / Petzold, M. | |
Contributing Institute: |
Halbleiter-Nanoelektronik; IBN-1 JARA-FIT; JARA-FIT |
Imprint: |
Pennington, NJ
Electrochemical Society (ECS)
2008
|
Physical Description: |
311 |
DOI: |
10.1149/1.2982883 |
Document Type: |
Contribution to a book |
Research Program: |
Grundlagen für zukünftige Informationstechnologien |
Series Title: |
ECS transactions
16 |
Publikationsportal JuSER |
Description not available. |