1
Lead-free soldering process development and reliability [E-Book] /
2
Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT 2013), December 31, 2013 - January 2, 2014, Brisbane Australia [E-Book] /
3
Hermeticity of electronic packages [E-Book] /
Subject (ZB): ...Electronic packaging....

Full text 
4
Semiconductor packaging : materials interaction and reliability [E-Book] /
5
LED packaging for lighting applications : design, manufacturing, and testing [E-Book] /
6
Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging [E-Book] /
7
Electronic packaging materials science 0007: symposium : MRS fall meeting 1993 : Boston, MA, 29.11.93-01.12.93.
Book
Subject (ZB): ...electronic packaging...
8
Handbook of multilevel metallization for integrated circuits : materials, technology, and applications /
Book
Subject (ZB): ...electronic packaging...
9
Electronic packaging materials science 0006: symposium : MRS spring meeting 1992 : San-Francisco, CA, 27.04.92-30.04.92.
Book
Ho, P. S.
1992
Subject (ZB): ...electronic packaging...
10
Electronic packaging materials science. vol 0005 : Materials Research Society Symposium on Electronic Packaging Materials Science : Boston, MA, 26.11.90-29.11.90.
Book
11
Materials science of high temperature polymers for microelectronics : Symposium on materials science of high temperature polymers for microelectronics : MRS spring meeting 1991: symposium J : Anaheim, CA, 29.04.91-02.05.91.
Book
12
Mechanical behavior of materials and structures in microelectronics : Symposium on the mechanical behavior of materials and structures in microelectronics: proceedings : MRS spring meeting 1991: symposium H : Anaheim, CA, 30.04.91-03.05.91.
Book
13
Materials for high-density electronic packaging and interconnection : report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council [E-Book]
14
Microelectronics processing: chemical engineering aspects /
Book
Subject (ZB): ...electronic packaging...
15
Reliability physics 1986: symposium : Anaheim, CA, 01.04.86-03.04.86.
Book
1986
Subject (ZB): ...electronic packaging...
16
Electronic packaging materials science. 0002 : Electronic packaging materials science: symposium. 0002 : Palo-Alto, CA, 15.04.1986-18.04.1986.
Book
Subject (ZB): ...electronic packaging...
17
Reliability physics 1985: symposium : Orlando, FL, 26.03.85-28.03.85.
Book
1985
Subject (ZB): ...electronic packaging...
18
Annual international electronics packaging conference 0003: technical conference: proceedings : Itasca, IL, 24.10.83-26.10.83.
Book
1983
Subject (ZB): ...electronic packaging...