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Mechanische Spannungen und Elektromigration in passivierten Leiterbahnen [E-Book] /
“...FGMH - Metallization, physics of microelectronics...”

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Materials reliability in microelectronics. 8 : symposium held April 13-16, 1998, San Francisco, California, USA /
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In-situ TEM-Untersuchungen des durch thermische Spannungen und Elektromigration induzierten Materietransports in Al-Leiterbahnen [E-Book] /
“...FGMH - Metallization, physics of microelectronics...”

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Materials reliability in microelectronics. 6 : symposium held April 8-12.1996, San Francisco, California, USA /
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Materials reliability in microelectronics. 5 : symposium San-Francisco, CA, 17.04.95-21.04.95.
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Electromigration and electronic device degradation /
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Materials reliability in microelectronics. 3 : symposium San-Francisco, CA, 12.04.93-15.04.93.
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International reliability physics symposium 1991 : New-Orleans, LA, 27.03.90-29.03.90.
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Symposia on reliability of semiconductor devices and interconnection and multilevel metallization, interconnection and contact technologies: proceedings : Fall meeting of the Electrochemical Society : Chicago, IL, 09.10.88-14.10.88.
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Reliability physics 1986: symposium : Anaheim, CA, 01.04.86-03.04.86.
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Electromigration of metals: proceedings of the symposium : Electrochemical Society: meeting. 0166 : New-Orleans, LA, 07.10.1984-12.10.1984.
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Reliability physics 1985: symposium : Orlando, FL, 26.03.85-28.03.85.
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1985
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Grundlagen der Elektrodiffusion zur Zuverlässigkeitsverbesserung von Al Leitbahnen für hochintegrierte Schaltungen /
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