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1
E-Book
The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects [E-Book] /
Grossmann, Günter.
2011
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2
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Introductory MEMS [E-Book] : Fabrication and Applications /
Adams, Thomas M.
2010
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3
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Materials for Information Technology [E-Book] : Devices, Interconnects and Packaging /
Zschech, Ehrenfried.
2005
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4
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MEMS Materials and Processes Handbook [E-Book] /
Ghodssi, Reza.
2011
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5
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Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging [E-Book] /
Suhir, E.
2007
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6
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Micromachined Thin-Film Sensors for SOI-CMOS Co-Integration [E-Book] /
Laconte, J.
2006
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7
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Three Dimensional Integrated Circuit Design [E-Book] : EDA, Design and Microarchitectures /
Xie, Yuan.
2010
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8
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Wafer Level 3-D ICs Process Technology [E-Book] /
Tan, Chuan Seng.
2008
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Name
Adams, Thomas M.
1
Cong, Jason.
1
Flandre, D.
1
Ghodssi, Reza.
1
Grossmann, Günter.
1
Gutmann, Ronald J.
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Laconte, J.
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Layton, Richard A.
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Lee, Y. C.
1
Lin, Pinyen.
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Mikolajick, Thomas.
1
Raskin, J. -P.
1
Reif, L. Rafael.
1
Sapatnekar, Sachin.
1
Suhir, E.
1
Tan, Chuan Seng.
1
Whelan, Caroline.
1
Wong, C. P.
1
Xie, Yuan.
1
Zardini, Christian.
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Zschech, Ehrenfried.
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