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Contribution to a book
Strained Silicon on Wafer Level by Wafer Bonding: Materials Processing, Strain Measurements and Strain Relaxation
Reiche, M.
2008
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Muster
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Buca, Dan Mihai
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Christiansen, S.
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Erfurth, W.
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Gösele, U.
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Himcinschi, C.
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Loo, R.
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Mantl, S.
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Moutanabir, O.
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Muster, F.
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Nguyen, D.
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Reiche, M.
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Grundlagen für zukünftige Informationstechnologien
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Halbleiter-Nanoelektronik; IBN-1
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JARA-FIT; JARA-FIT
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2008
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