Micro materials : 3rd international conference and poster exhibition : proceedings : MicroMat 2000, April 17 - 19, 2000, Berlin, Germany / eds.: B. Michel ... ; org.: IZM - Fraunhofer Institute for Reliability and Microintegration, Berlin ...
Saved in:
Personal Name(s): | Michel, B., editor |
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Imprint: |
Dresden :
Verl. DDP Goldenbogen,
2000.
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Physical Description: |
1309 S. |
Note: |
englisch |
ISBN: |
9783932434150 3932434153 |
Series Title: |
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MicroMat ;
3. |
Keywords: |
packaging materials nanomaterials, micro- and nanoprobe techniques high temperature electronics and thermal problems thin films, layers, interfaces sensor and actuator materials solder materials, bonding, joining mechanical properties, stress, strain, reliability, failure, crack, fatigue testing and characterization polymers, ceramics, glass, diamond, hard coatings electrical and electronic properties microfabrication, micromachining, micromanufactoring, mechatronics |
Subject (ZB): | |
Classification: |
ZB | |
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Open Stacks Call number: S 008802-0003'01' Barcode: 1201100708 Available |