Handbook of multilevel metallization for integrated circuits : materials, technology, and applications / edited by Syd R. Wilson and Clarence J. Tracy, John L. Freeman, Jr.
Saved in:
Personal Name(s): | Wilson, Syd Robert. |
---|---|
Tracy, Clarence J. / Freeman, John L. | |
Imprint: |
Park Ridge, N.J., U.S.A. :
Noyes,
1993.
|
Physical Description: |
xxiii, 887 p. |
Note: |
englisch |
ISBN: |
9780815513407 0815513402 |
Series Title: |
/* Depending on the record driver, $field may either be an array with
"name" and "number" keys or a flat string containing only the series
name. We should account for both cases to maximize compatibility. */?>
Materials science and process technology series.
|
Keywords: |
multilevel metallization (MLM): introduction silicides and contacts for ULSI aluminum- based multilevel metallizations in VLSI\ULSICs inorganic dielectrics in multilevel metallization organic dielectrics in multilevel metallization of ICs planarization techniques lithography and etch issues for a multilevel metallization system electromigration and stress migration in MLM interconnect structures multilevel metallization test vehicle multilevel metallization: manufacturing and analytic methods characterization techniques for VLSI multilevel metallization electronic packaging and its influences on integrated circuit design and processing future interconnect systems |
Subject (ZB): | |
Classification: | |
Shelf Classification: |
ZB | |
---|---|
Reading Room Call number: FGM 109 Barcode: 1094103635 Available |