Metallization of Polymers 2 [E-Book] / edited by Edward Sacher.
As the demands put on the polymer/metal interface, particularly by the microelectronics industry, become more and more severe, the necessity for understanding this interface, its properties and its limitations, becomes more and more essential. This requires a broad knowledge of, and a familiarity wi...
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Full text |
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Personal Name(s): | Sacher, Edward, editor |
Imprint: |
Boston, MA :
Springer,
2002
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Physical Description: |
VIII, 208 p. online resource. |
Note: |
englisch |
ISBN: |
9781461505631 |
DOI: |
10.1007/978-1-4615-0563-1 |
Subject (LOC): |
- New Instrumentation
- 1. Surface Analysis Using Confocal Raman Micro-spectroscopy
- 2. Ellipsometric Characterization of the Optical Constants of Metals: Thin Film versus Nanoparticle
- 3. Ultra Thin Film Analysis Using the Thermo VG Scientifics Thetaprobe Instrument
- 4. Nanoindentation of Microsprings and Microcantilevers
- Low Permittivity Materials
- 5. Physical and Interfacial Properties of Low Permittivity Polymers: Cyclotene, SiLK and Ultra-Low K
- 6. Mechanical Properties of Cured Silk Low-K Dielectric Films
- 7. Plasma-Polymerized Fluoropolymer Thin Films for Microelectronic Applications
- Polymer Metallization
- 8. Fundamental Aspects of Polymer Metallization
- 9. The Study of Copper Clusters on Dow Cyclotene and Their Stability
- 10. Adsorption of Noble Metal Atoms on Polymers
- 11. Nucleation and Growth of Vapor-Deposited Metal Films on Self-Assembled Monolayers Studied by Multiple Characterization Probes
- Barrier Layers
- 12. Morphological Investigations of Low-k Polymer/Diffusion Barrier Interfaces for IC Metallization
- 13. Chemistry in the Initial Formation of Nitride Barriers on Low-K Dielectrics
- 14. Capabilities and Limitations of RBS to Characterize Hyper-Thin Silicon Compound on Various Polymeric Substrates
- Adhesion Enhancement
- 15. Surface Modifications by Ion-Assisted Reactions
- 16. Plasma and VUV Pretreatments of Polymer Surfaces for Adhesion Enhancement of Electrolessly Deposited Ni or Cu Films.