Metallized Plastics 2 [E-Book] : Fundamental and Applied Aspects / edited by Kashmiri Lal Mittal.
This volume documents the proceedings of the Second Symposium on Metallized Plastics: Fundamental and Applied Aspects held under the aegis of the Dielectric Science and Technology Division of the Electrochemical Society in Montreal, Canada, May 7-10, 1990. The first symposium on this topic was held...
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Full text |
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Personal Name(s): | Mittal, Kashmiri Lal, editor |
Imprint: |
Boston, MA :
Springer,
1991
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Physical Description: |
IX, 477 p. online resource. |
Note: |
englisch |
ISBN: |
9781489907356 |
DOI: |
10.1007/978-1-4899-0735-6 |
Subject (LOC): |
- I. Metallization Techniques and Properties of Metal Deposits
- An Electrochemical Method of Polyimide Metallization
- Electroplating of Polymers, Gas Permeability and Adhesion of the Composite Materials
- Molecular Level Metal and Ceramic/Polymer Composites. Synthesis of Metal and Metal Oxide Containing Polyimides and its Relevance to Polymer Metallization
- Photolithographic Plating of Platinum and Copper on Insulating Substrates
- Metallized Indium Island Films for Flexible Automotive Trim
- Metallization of Plastics by Physical Vapor Deposition Techniques
- Ion Beam Assisted Metallization of Plastics
- Plasma Induced Deposition of Copper Films on Polymer Surfaces
- Metallization of Polytetrafluoroethylene (PTFE) by Means of Plasma-Enhanced Chemical Vapour Deposition
- Metallization of Plastics Via Low Temperature Arc Vapor Deposition (LTAVD)
- Magnetron Sputtered Tin Hard Coatings on Plastics
- Diffusion and Gettering Simulations of Ion Implanted Copper in Polyimide
- II. Investigation of Interfacial Interactions
- Comparison Between the Interfacial Chemistry of Metallized Polyimides and Polyimide Films on Bulk Metal Substrates
- Chemical Interactions at Polymer-Metal Interfaces of Interest to Microelectronics
- Photoelectron Spectroscopy Model Study of the Interface Between Polyimide and Copper
- Electronic Structure of Metal/Polymer Interfaces: Aluminum on Conjugated Polymers
- Study of Chemical Interactions in Metallized Polymers Used for Microelectronic Packaging
- XPS Study of the Interface Between Thermally Evaporated Aluminium and Polyethyleneterephthalate: Evidence for Oxycarbide Species
- XPS-Study of Metal-Polymer Interfaces After Polymer Surface Treatment by Ion and Plasma Techniques
- Behavior of Metal-Polyimide Interfaces Under Degradative Ambients
- Study of Titanium/Polyimide Interface in a Reducing Environment
- III. Plastic Surface Modifications
- Ion Beam Induced Chemical Reactions at Polymer Surfaces
- Surface Pre-treatment and Metal Coating of Commercial Polyimide Studied by Surface Analytical Techniques
- Characterization of a Surface Chemically-Modified Polyimide
- Diffusion of Ions in a Surface Chemically-Modified Polyimide
- Modification of Polymer Surfaces by Dual Frequency Plasma
- Electrochemical Reduction of PMDA-ODA and Effects on Metal/Polyimide Interfacial Reliability
- IV. Adhesion Aspects of Metallized Plastics
- Sticky Polymers Through Ion Beam Processing
- Molecular Dynamic Phenomena at Polymer Surfaces and Their Relevance to Polymer Adhesion Behavior
- Enhanced Metal/Polymer Adhesion by Ion Assisted Deposition
- An Improved Process to Facilitate the Chemical Bonding of Electroless Copper to Polyetherimide Surfaces
- Adherent Electroless Copper Layers on Polystyrene
- Correlation Between Surface Chemistry of Polycarbonate and its Adhesion Behavior to Electrolessly Plated Copper
- Water-Induced Degradation of Metal/Polyimide Interfaces
- Thin Film Adhesion Measurement Using Excimer Laser Ablation and Tensile Extension Tests
- About the Contributors.