Epoxy Resins and Composites IV [E-Book] / edited by K. Dušek.
Saved in:
Full text |
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Personal Name(s): | Dušek, K., editor |
Imprint: |
Berlin, Heidelberg :
Springer,
1986
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Physical Description: |
XIII, 220 p. online resource. |
Note: |
englisch |
ISBN: |
9783540397755 |
DOI: |
10.1007/3-540-16423-5 |
Series Title: |
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Advances in Polymer Science ;
80 |
Subject (LOC): |
- Dielectric analysis of thermoset cure
- Epoxy-aromatic amine networks in the glassy state structure and properties
- Void growth and resin transport during processing of thermosetting — Matrix composites
- Physical aging in epoxy matrices and composites
- Curing mechanisms and mechanical properties of cured epoxy resins.