Mechanical Microsensors [E-Book] / by Miko Elwenspoek, Remco Wiegerink.
Fabrication technologies related to those which are exploited for the fabrication of integrated circuits can be used to machine mechanical structures with minimum feature sizes in the range of micrometers. The mechanical machining of silicon based on IC-technologies is known as micromachining, and t...
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Full text |
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Personal Name(s): | Elwenspoek, Miko, author |
Wiegerink, Remco, author | |
Imprint: |
Berlin, Heidelberg :
Springer,
2001
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Physical Description: |
X, 295 p. online resource. |
Note: |
englisch |
ISBN: |
9783662043219 |
DOI: |
10.1007/978-3-662-04321-9 |
Series Title: |
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Microtechnology and MEMS
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Subject (LOC): |
- 1. Introduction
- 2. MEMS
- 2.1 Miniaturisation and Systems
- 2.2 Examples for MEMS
- 2.3 Small and Large: Scaling
- 2.4 Available Fabrication Technology
- 3. Introduction into Silicon Micromachining
- 3.1 Photolithography
- 3.2 Thin Film Deposition and Doping
- 3.3 Wet Chemical Etching
- 3.4 Waferbonding
- 3.5 Plasma Etching
- 3.6 Surface Micromachining
- 4. Mechanics of Membranes and Beams
- 4.1 Dynamics of the Mass Spring System
- 4.2 Strings
- 4.3 Beams
- 4.4 Diaphragms and Membranes
- 5. Principles of Measuring Mechanical Quantities: Transduction of Deformation
- 5.1 Metal Strain Gauges
- 5.2 Semiconductor Strain Gauges
- 5.3 Capacitive Transducers
- 6. Force and Pressure Sensors
- 6.1 Force Sensors
- 6.1.1 Load Cells
- 6.2 Pressure Sensors
- 7. Acceleration and Angular Rate Sensors
- 7.1 Acceleration Sensors
- 7.2 Angular Rate Sensors
- 8. Flow sensors
- 8.1 The Laminar Boundary Layer
- 8.2 Heat Transport in the Limit of Very Small Reynolds Numbers
- 8.3 Thermal Flow Sensors
- 8.4 Skin Friction Sensors
- 8.5 “Dry Fluid Flow” Sensors
- 8.6 “Wet Fluid Flow” Sensors
- 9. Resonant Sensors
- 9.1 Basic Principles and Physics
- 9.2 Excitation and Detection Mechanisms
- 9.3 Examples and Applications
- 10. Electronic Interfacing
- 10.1 Piezoresistive Sensors
- 10.2 Capacitive Sensors
- 10.3 Resonant Sensors
- 11. Packaging
- 11.1 Packaging Techniques
- 11.2 Stress Reduction
- 11.3 Pressure Sensors
- 11.4 Inertial Sensors
- 11.5 Thermal Flow Sensors
- References.