Wafer Bonding [E-Book] : Applications and Technology / edited by Marin Alexe, Ulrich Gösele
During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication method...
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Full text |
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Personal Name(s): | Alexe, Marin, editor |
Gösele, Ulrich, editor | |
Imprint: |
Berlin, Heidelberg :
Springer,
2004
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Physical Description: |
XV, 504 p. 383 illus., 20 illus. in color. online resource. |
Note: |
englisch |
ISBN: |
9783662108277 |
DOI: |
10.1007/978-3-662-10827-7 |
Series Title: |
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Springer Series in MATERIALS SCIENCE ;
75 |
Subject (LOC): |
- 1 Direct Bonding, Fusion Bonding, Anodic Bonding, Wafer Bonding: A Historical Patent Picture of the Worldwide Moving Front of the State-of-the-Art of Contact Bonding
- 2 Basics of Silicon-on-Insulator (SOI) Technology
- 3 Silicon-on-Insulator by the Smart CutTM Process
- 4 ELTRAN® Technology Based on Wafer Bonding and Porous Silicon
- 5 Wafer Bonding for High-Performance Logic Applications
- 6 Application of Bonded Wafers to the Fabrication of Electronic Devices
- 7 Compound Semiconductor Heterostructures by Smart CutTM: SiC On Insulator, QUASICTM Substrates, InP and GaAs Heterostructures on Silicon
- 8 Three-Dimensional Photonic Bandgap Crystals by Wafer Bonding Approach
- 9 Wafer Direct Bonding for High-Brightness Light-Emitting Diodes and Vertical-Cavity Surface-Emitting Lasers
- 10 High-Density Hybrid Integration of III–V Compound Optoelectronics with Silicon Integrated Circuits
- 11 Layer Transfer by Bonding and Laser Lift-Off
- 12 Single-Crystal Lithium Niobate Films by Crystal Ion Slicing
- 13 Wafer Bonding of Ferroelectric Materials
- 14 Debonding of Wafer-Bonded Interfaces for Handling and Transfer Applications.