11th international congress molded interconnect devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany [E-Book] / edited by Jörg Franke [and three others].
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Full text |
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Personal Name(s): | Franke, Jörg, editor |
Imprint: |
Pfaffikon, Switzerland :
TTP,
2014
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Physical Description: |
1 online resource (119 pages) : illustrations. |
Note: |
englisch |
ISBN: |
9783038266365 (e-book) |
Series Title: |
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Advanced Materials Research ;
Volume 1038 |
Subject (LOC): |
Description not available. |