This title appears in the Scientific Report :
2004
Please use the identifier:
http://dx.doi.org/10.1238/Physica.Topical.111a00138 in citations.
Modeling of material mixing effects on plasma surface interactions in magnetic fusion devices
Modeling of material mixing effects on plasma surface interactions in magnetic fusion devices
The material mixing effects on the erosion and deposition processes of W under simultaneous bombardment with deuterium (D) ions and a small amount of carbon (C) ions are investigated by using a dynamic Monte Carlo simulation code, EDDY. The transition from deposition to erosion occurs abruptly when...
Saved in:
Personal Name(s): | Ohya, K. |
---|---|
Tanabe, T. / Kirschner, A. / Philipps, V. / Noda, N. | |
Contributing Institute: |
Institut für Plasmaphysik; IPP |
Published in: | Physica scripta, T111 (2004) S. 138 - 144 |
Imprint: |
Bristol
IoP Publ.
2004
|
Physical Description: |
138 - 144 |
DOI: |
10.1238/Physica.Topical.111a00138 |
Document Type: |
Journal Article |
Research Program: |
Kernfusion und Plasmaforschung |
Series Title: |
Physica Scripta Topical Issue
111 |
Subject (ZB): | |
Publikationsportal JuSER |
The material mixing effects on the erosion and deposition processes of W under simultaneous bombardment with deuterium (D) ions and a small amount of carbon (C) ions are investigated by using a dynamic Monte Carlo simulation code, EDDY. The transition from deposition to erosion occurs abruptly when the plasma temperature is increased. Below the transition temperature, a thick C layer appears as a result of the low reflection coefficient of the deposited C so that the W is perfectly protected against sputter erosion. Above the transition temperature, a balance between the incident and released C on the W surface is reached where the surface is eroded only due to the reduced physical sputtering of the W-C mixed layer.The erosion and deposition patterns observed on the W side of the W-C twin test limiter exposed to TEXTOR edge plasmas are reproduced by using the modified EDDY code. On most parts of the surface, the enhanced physical sputtering of the deposited C suppresses the formation of a thick C layer, whereas near the limiter edge the C deposition dominates where the thickness increases with increasing C fluence. The extent of the deposited area which is broader on Ta than on W is simulated due to higher surface temperature (stronger diffusion) or lower chemical sputtering yield of the deposited C. |