This title appears in the Scientific Report :
2018
Please use the identifier:
http://hdl.handle.net/2128/18512 in citations.
Structure of Interfaces in Cu$|$Au Nanolaminates
Structure of Interfaces in Cu$|$Au Nanolaminates
We used molecular dynamics calculations to study the influence of interdiffusion on the bicrystal interface of Cu$|$Au nanolaminates. Starting from an ideal bicrystal of 50 nm thickness with a $\{111\}$ semi-coherent interface, we created a diffusive interface region and annealed the system at 1000...
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Personal Name(s): | Gola, A. |
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Pastewka, L. (Corresponding author) | |
Contributing Institute: |
John von Neumann - Institut für Computing; NIC |
Published in: |
NIC Symposium 2018 |
Imprint: |
Jülich
Forschungszentrum Jülich GmbH, Zentralbibliothek
2018
|
Physical Description: |
247 - 254 |
Conference: | NIC Symposium 2018, Jülich (Germany), 2018-02-22 - 2018-02-23 |
Document Type: |
Contribution to a book Contribution to a conference proceedings |
Research Program: |
ohne Topic |
Series Title: |
NIC Series
49 |
Link: |
OpenAccess |
Publikationsportal JuSER |
We used molecular dynamics calculations to study the influence of interdiffusion on the bicrystal interface of Cu$|$Au nanolaminates. Starting from an ideal bicrystal of 50 nm thickness with a $\{111\}$ semi-coherent interface, we created a diffusive interface region and annealed the system at 1000 K. We report the resulting interfacial crystallographic defects as a function of interface width. Our results show an increase of dislocation spacing as the interface becomes more diffuse. The most diffuse interfaces of $\sim$ 10 nm width studied here form stacking fault tetrahedra. |