This title appears in the Scientific Report :
2018
Numerical Study on Particle Trajectories Close to the Substrates in Thermal Spray Processes with High Kinetic and Low-Pressure Conditions
Numerical Study on Particle Trajectories Close to the Substrates in Thermal Spray Processes with High Kinetic and Low-Pressure Conditions
In thermal spray processes, the interaction between the gas jet and the particulate feedstock can affect the coating build-up mechanisms considerably. Especially under high-kinetic and low-pressure conditions, small particles are subjected to rapid deflection and velocity changes close to the substr...
Saved in:
Personal Name(s): | Mauer, Georg (Corresponding author) |
---|---|
Vassen, Robert | |
Contributing Institute: |
Werkstoffsynthese und Herstellungsverfahren; IEK-1 |
Imprint: |
Materials Park, OH
ASM International
2018
|
Physical Description: |
422 - 429 |
Conference: | International Thermal Spray Conference, Orlando, Florida (USA), 2018-05-07 - 2018-05-10 |
Document Type: |
Contribution to a conference proceedings |
Research Program: |
Methods and Concepts for Material Development |
Publikationsportal JuSER |
In thermal spray processes, the interaction between the gas jet and the particulate feedstock can affect the coating build-up mechanisms considerably. Especially under high-kinetic and low-pressure conditions, small particles are subjected to rapid deflection and velocity changes close to the substrate. In this work, numerical studies were performed to investigate the particle trajectories in the substrate boundary layers. Typical conditions for suspension plasma spraying (SPS), suspension high-velocity oxy fuel spraying (SHVOF), aerosol spraying (AS), and plasma spray-physical vapor deposition (PS-PVD) were taken as a basis. Particular importance was attached to the consideration of rarefaction and compressibility effects on the drag force. The particle impact conditions in the different thermal spray processes are compared. Possible effects on the resulting coating build-up mechanisms are discussed. |