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Table of Contents: “...Research and Development History of Three Dimensional (3D) Integration Technology -- Recent Research and Development Activities of Three Dimensional (3D) Integration Technology -- TSV Processes -- Wafer and Die Bonding Processes -- Metrology...”

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Table of Contents: “...Challenges in ULSI Interconnects - Introduction to the Book -- Technology Background -- MOS Device and Interconnects Scaling Physics -- Interconnects in ULSI Systems: Cu Interconnects Electrical Performance -- Electrodeposition -- Electrophoretic...”

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Table of Contents: “...1. The Cmos Technology Platform -- 2. Systems on a Chip -- 3. Microsystems -- 4. Soi Technology -- 5. Neuromorphic Engineering -- 6. Vertebrate Retina Emulation Using Multi-Layer Array-Processor Mixed-Signal Chips -- 7. CMOS Mixed-Signal Flexible Vision...”

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Table of Contents: “... Practical Aspects of Preparation and Evaluation of Electrochemical Capacitors -- 20 Technology Development -- 21 Patent Survey....”

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Table of Contents: “... -- Components and Technology for a Fluidic-Isfet- Microsystem -- An on-Chip Miniature Liquid Chromatography System: Design, Construction and Characterization -- A Microsystem Mass Spectrometer -- Authors Index....”

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Table of Contents: “...Hydrogen as an Energy Carrier — A Guide -- A: Significance and Use of Hydrogen -- 1. Energy Supply Structures and the Importance of Gaseous Energy Carriers -- 2. Technologies for the Energetic Use of Hydrogen -- 3. Hydrogen as Raw Material -- 4. Safety...”

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Table of Contents: “... -- 2. Electric Transportation Vehicles -- 3. Electrochemical Power Source Requirements -- 4. Identification of Candidate Power Sources for Electric Vehicles -- 5. Electrochemical Power Source Technology -- 6. Summary and Concluding Remarks -- References...”

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