1
Electronic packaging materials science 0007: symposium : MRS fall meeting 1993 : Boston, MA, 29.11.93-01.12.93.
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“...FGMH - Metallization, physics of microelectronics...”
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Electronic packaging materials science 0006: symposium : MRS spring meeting 1992 : San-Francisco, CA, 27.04.92-30.04.92.
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Ho, P. S.
1992
“...FGMH - Metallization, physics of microelectronics...”
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Mechanical behavior of materials and structures in microelectronics : Symposium on the mechanical behavior of materials and structures in microelectronics: proceedings : MRS spring meeting 1991: symposium H : Anaheim, CA, 30.04.91-03.05.91.
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Suhir, E.
1991
“...FGMH - Metallization, physics of microelectronics...”
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Electronic packaging materials science. vol 0005 : Materials Research Society Symposium on Electronic Packaging Materials Science : Boston, MA, 26.11.90-29.11.90.
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“...FGMH - Metallization, physics of microelectronics...”
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Electronic packaging materials science. 0002 : Electronic packaging materials science: symposium. 0002 : Palo-Alto, CA, 15.04.1986-18.04.1986.
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“...FGMH - Metallization, physics of microelectronics...”
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