1
Eddy-Current Nondestructive Evaluation [E-Book] /
2
Die-Attach Materials for High Temperature Applications in Microelectronics Packaging [E-Book] : Materials, Processes, Equipment, and Reliability /
3
Evaluating Measurement Accuracy [E-Book] : A Practical Approach /
4
Advances in Acoustic Emission Technology [E-Book] : Proceedings of  the World Conference on Acoustic Emission-2015 /
5
Advances in Acoustic Emission Technology [E-Book] : Proceedings of the World Conference on Acoustic Emission-2013 /
6
Solder Joint Reliability Assessment [E-Book] : Finite Element Simulation Methodology /
7
Particulate Products [E-Book] : Tailoring Properties for Optimal Performance /
8
Evaluating Measurement Accuracy [E-Book] : A Practical Approach /
9
Computational Electromagnetics and Model-Based Inversion [E-Book] : A Modern Paradigm for Eddy-Current Nondestructive Evaluation /
10
Towards Estimating Entrainment Fraction for Dust Layers [E-Book]/