41
Tungsten and other advanced metals for VLSI/ULSI applications. 0005 : Workshop on Tungsten and Other Advanced Metals for VLSI/ULSI Applications : 0005: proceedings : San-Mateo, CA, Tokyo, 20.09.89-21.09.89 ; 19.10.89-20.10.89
Book
42
Advanced metallizations in microelectronics : Symposium on Advanced Metallizations in Microelectronics: proceedings : Spring Meeting of the Materials Research Society. 1990 : San-Francisco, CA, 16.04.90-20.04.90.
Book
43
Thermal stress induced grain boundary cavitation in narrow, aluminum alloy metallizations.
Book
...FGMH - Metallization, physics of microelectronics...
44
Advanced electronic packaging materials : Symposium on advanced electronic packaging materials: proceedings : Materials research society meeting : Boston, MA, 27.11.89-29.11.89.
Book
45
Metallization of polymers : International Symposium on the Metallization of Polymers : Montreal, 24.09.89-28.09.89.
Book
Sacher, E.
1990
...FGMH - Metallization, physics of microelectronics...
46
International IEEE VLSI multilevel interconnection conference 0007: proceedings : VMIC 1990: proceedings : Santa-Clara, CA, 12.06.90-13.06.90.
Book
1990
...FGMH - Metallization, physics of microelectronics...
47
Electronic materials science : for integrated circuits in Si and GaAs /
Book
...FGMH - Metallization, physics of microelectronics...
48
International reliability physics symposium 1991 : New-Orleans, LA, 27.03.90-29.03.90.
Book
...FGMH - Metallization, physics of microelectronics...
49
Microelectronics packaging handbook /
Book
...FGMH - Metallization, physics of microelectronics...
50
Principles of electronic packaging /
Book
...FGMH - Metallization, physics of microelectronics...
51
Reliability physics 1989: symposium : Phoenix, AZ, 11.04.89-13.04.89.
Book
1989
...FGMH - Metallization, physics of microelectronics...
52
Electronic packaging materials science. 0004 : Symposium on electronic packaging materials science : Spring meeting of the Materials Research Society. 1989 : San-Diego, CA, 24.04.89-28.04.89.
Book
53
Tungsten and other refractory metals for VLSI applications. 4 : International workshop on tungsten and other refractory metals for VLSI applications. 1988: proceedings : Albuquerque, NM, 04.10.88-06.10.88.
Book
54
Symposia on reliability of semiconductor devices and interconnection and multilevel metallization, interconnection and contact technologies: proceedings : Fall meeting of the Electrochemical Society : Chicago, IL, 09.10.88-14.10.88.
Book
55
International IEEE VLSI multilevel interconnection conference 0006: proceedings : Santa-Clara, CA, 12.06.89-13.06.89.
Book
1989
...FGMH - Metallization, physics of microelectronics...
56
Chemical perspectives of microelectronic materials: symposium: proceedings : Materials Research Society fall meeting. 1988 : Boston, MA, 30.11.88-01.12.88.
Book
...FGMH - Metallization, physics of microelectronics...
57
Advanced CMOS process technology.
Book
...FGMH - Metallization, physics of microelectronics...
58
Mechanische Relaxationsspektroskopie an Aluminium Metallisierungsschichten für die Mikroelektronik [E-Book] /
59
Second German-Greek workshop on materials research for information technology, May 22 - May 23, 1989 [E-Book] /
60
Microelectronic materials.
Book
...FGMH - Metallization, physics of microelectronics...