Submicrometer metallization: the challenges, opportunities, and limitations : Submicrometer metallization: the challenges, opportunities, and limitations: conference : SPIE symposium on microelectronic processing : San-Jose, CA, 23.09.92-25.09.92.
metallization and interconnection
Saved in:
Personal Name(s): | Kwok, T., editor |
---|---|
Imprint: |
Bellingham, WA :
SPIE-The International Society for Optical Engineering,
1993.
|
Physical Description: |
IX, 344 S. |
Note: |
englisch |
ISBN: |
9780819410030 0819410039 |
Series Title: |
/* Depending on the record driver, $field may either be an array with
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SPIE proceedings ;
vol 1805. |
Subject (ZB): | |
Classification: |
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---|---|---|---|
001 | 50542 | ||
005 | 19970508000000.0 | ||
008 | r1993 | ||
020 | |a 0819410039 | ||
035 | |a (Sirsi) a48958 | ||
084 | 0 | |a FGMH - Metallization, physics of microelectronics |2 ZB | |
245 | 0 | 0 | |a Submicrometer metallization: the challenges, opportunities, and limitations : |b Submicrometer metallization: the challenges, opportunities, and limitations: conference : SPIE symposium on microelectronic processing : San-Jose, CA, 23.09.92-25.09.92. |
260 | |a Bellingham, WA : |b SPIE-The International Society for Optical Engineering, |c 1993. | ||
300 | |a IX, 344 S. | ||
490 | 0 | |a SPIE proceedings ; |v vol 1805. | |
500 | |a englisch | ||
520 | |a metallization and interconnection | ||
520 | |a materials and processes for metallization | ||
520 | |a reliability | ||
520 | |a electromigration | ||
596 | |a 1 | ||
650 | 4 | |a VLSI (very large scale integration) | |
650 | 4 | |a ULSI (ultra large scale integration) | |
650 | 4 | |a metallization | |
700 | 1 | |a Kwok, T., |e Hrsg. | |
710 | 2 | |a International Society for Optical Engineering. | |
900 | |a S 002308-1805'01' | ||
908 | |a Konferenz | ||
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