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1
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Kleben : Grundlagen, Technologie, Anwendung : Klebtechnik und Umwelt, 11. internationales Symposium 26. bis 28. Mai 1997 am ITR Rapperswil am Zürichsee : Swissbonding 97 /
Schindel-Bidinelli, Eduardo.
1997
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2
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Kleben : Leistungsfähigkeit der modernen Klebtechnik, multifunktionelle Klebverbindungen : Swissbonding 1996 10th international symposium, topic transportation : 10. Internationale...
Schindel-Bidinelli, Eduardo.
1996
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Kleben. Multifunktionelle Klebverbindungen, Leistungsfähigkeit der modernen Klebtechnik : Grundlagen, Technologie, Anwendung : Swissbonding 1995 : 9. Internationales Symposium Swis...
Schindel-Bidinelli, Eduardo.
1995
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4
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Adhesives in electronics 1994 : International conference on adhesive joining technology in electronics manufacturing 0001 : Berlin, 02.11.94-04.11.94.
1994
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Kleben : Grundlagen, Technologie, Anwendung : Leistungsfähigkeit der modernen Klebtechnik: Kleben, Dichten und Vergiessen in der Elektronik, Elektrotechnik, Feinmechanik, Optischen...
Schindel-Bidinelli, Eduardo
1994
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Joining and adhesion of advanced inorganic materials: symposium 0001: papers : MRS spring meeting 1993: papers : San-Francisco, CA, 12.04.93-14.04.93.
Carim, A. H.
1993
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6
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ZB
6
Name
Schindel-Bidinelli, Eduardo.
3
Carim, A. H.
1
Schindel-Bidinelli, Eduardo
1
Subject
bonding
adhesion
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adhesive
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ceramics
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composite materials
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electronic device
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joint
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THKF - Bonding
6
FAF - Materials research - comprehensive works
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TBA - Electronic engineering - general
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