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Wafer Bonding [E-Book] : Applications and Technology /
Table of Contents: ...-Cavity Surface-Emitting Lasers -- 10 High-Density Hybrid Integration of III–V Compound Optoelectronics with Silicon Integrated Circuits -- 11 Layer Transfer by Bonding and Laser Lift-Off -- 12 Single-Crystal Lithium Niobate Films by Crystal Ion Slicing -- 13...

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