1
2
Table of Contents:
“...Advanced Radiation Sensors VLSI Design in CMOS technology for High Energy Physics Applications -- Design, Operation and BER Test of Multi-Gb/s Radiation-Hard Drivers in 65 nm Technology for Silicon Photonics Optical Modulators -- A rad-hard bandgap...”
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Valle, Maurizio
2004
Table of Contents:
“...1. The Cmos Technology Platform -- 2. Systems on a Chip -- 3. Microsystems -- 4. Soi Technology -- 5. Neuromorphic Engineering -- 6. Vertebrate Retina Emulation Using Multi-Layer Array-Processor Mixed-Signal Chips -- 7. CMOS Mixed-Signal Flexible Vision...”2004
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Balestra, F.
2002
Table of Contents:
“...Innovation in material technologies -- Perspectives of SIMOX technology -- MBE growth of the top layer in Si/YSZ/Si structure -- SiCOI structures. Technology and characterization -- New SiC on insulator wafers based on the Smart-Cut® approach...”2002
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Shoop, Barry L.
2001
Table of Contents:
“...1. Introduction -- 1.1 The Role of A/D Conversion -- 1.2 Key Technological Challenges -- 1.3 Motivation for Photonic A/D Approaches -- 1.4 Organization of this Book -- 2. Performance Characteristics of Analog-to-Digital Converters -- 2.1 A/D Converter...”2001
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Grote, Norbert
2001
Table of Contents:
“... Technologies -- 8.4 Summary -- References -- 9 All-Optical Time-Division Multiplexing Technology -- 9.1 Role of All-Optical TDM Technology -- 9.2 Key Technologies for All-Optical TDM Systems -- 9.3 Demonstration of OTDM and OTDM/WDM Transmission -- References -- 10...”2001
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Zimmermann, Horst
2000
Table of Contents:
“...1. Basics of Optical Emission and Absorption -- 2. Theory -- 3. Silicon Technologies and Integrated Photodetectors -- 4. Optoelectronic Devices in Silicon-on-Insulator -- 5. Silicon Power Devices -- 6. SiGe Photodetectors -- 7. Detectors Based on a...”2000
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Hemment, Peter L. F.
2000
Table of Contents:
“...Section 1: Innovations in Materials Technologies -- 1.1 Invited “SMART-CUT® Technology: Basic Mechanisms and Applications” -- 1.2 Invited “Polish Stop Technology for Silicon on Silicide on Insulator Structures” -- 1.3 Invited “Homoepitaxy on Porous...”2000
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Williams, P. F.
1997
Table of Contents:
“... -- Magnetized Surface-Wave Discharges for Submicrometer Pattern Transfer -- Dusty Plasmas: Fundamental Aspects and Industrial Applications -- Industrial Application of Plasmas for Processing -- Low Energy Plasma Beams for Semiconductor Technology -- Process Control...”1997
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Andreev, Nikolai
1997
Table of Contents:
“... Laser Diode Structures -- 1.3 Microcavity Semiconductor Lasers -- 2. MQW Optoelectronic Devices and Systems -- 2.1 Exciton Absorption Saturation and Camer Transport in Quantum Well Semiconductors -- 2.2. Integrated Optoelectronics — the Next Technological...”1997
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Harsányi, Gábor
1995
Table of Contents:
“... on Cofired Ceramic,” -- “New Aspects in the Reliability Design of High Density Interconnects in MCMs,” -- “MCM-D Technology with Active and Passive Substrates,” -- “High Performance Ceramic Modules and Packages,” -- “Laser Processing in MCM-C Technologies...”1995
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Colinge, J. P.
1995
Table of Contents:
“... by Low Temperature Chemical Vapor Deposition for SOI Applications -- Direct Formation of Thin Film Nitride Structures by High Intensity Ion Implantation of Nitrogen into Silicon -- Stimulated Technology for Implanted SOI Formation -- Behaviour of Oxygen...”1995
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El-Kareh, Badih
1995
Table of Contents:
“... Technology -- 8.1 Contact Metallurgy -- 8.2 Poly-Metal Dielectrics -- 8.3 Metal Interconnects -- 8.4 Inter-Level Dielectrics -- 8.5 Multi-Level Metals -- 8.6 Reliability Considerations....”1995
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Table of Contents:
“... -- 2.4 Skin Effect -- 2.5 Thermal Properties -- 2.6 Design Constraints -- 2.7 Technology -- 2.8 Performance -- 2.9 New Transit-Time Device Concepts -- References -- 3. Schottky Contacts on Silicon -- 3.1 Schottky-Barrier Models -- 3.2 Epitaxial Diodes on Si...”
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Chester, A. N.
1993
Table of Contents:
“... and Flexibility of Laser Materials Processing -- Laser Welding Technology for Joining Different Sheet Metals for One Piece Stamping -- Laser Applications for 3-D Components: Beam Delivery Systems and Robotics -- Laser Blank Welding and Stamping of Sheet Metal Parts...”1993
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Miller, L. S.
1991
Table of Contents:
“... Conductivity by Doping -- 13 Silicon Processing: CMOS Technology -- 14 Technologies for High-Speed Compound Semiconductor ICs -- 15 Phosphors and Luminescence -- 16 Microstructural and Compositional Characterization of Thin-Film Semiconductor Materials...”1991
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