1
Nikitin, Mikhail
2021
Table of Contents:
“...Novel thin film and multilayer thermoelectric materials -- Simulation of phenomena related to thermoelectricity -- Thermoelectric thin film and multilayer materials manufacturing technologies -- Measurement techniques for Characterization thin film...”2021
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2
Fujita, Shizuo
2020
Table of Contents:
“... deposition (PLD) (Akira Ohtomo, Tokyo Institute of Technology, Japan) -- 10. Homoepitaxial growth of β-Ga2O3 thin films on β-Ga2O3 substrates (Michele Baldini, IKZ Berlin, Germany) -- 11. Heteroepitaxial growth of ε-Ga2O3 on sapphire substrates (Roberto Fornari...”2020
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3
Adachi, Chihaya
2020
Table of Contents:
“...OLED Fundamentals -- OLED Material Design -- Device Fabrication -- Display Design -- Lighting -- Encapsulation + Flexible Technology -- Degradation -- Recent Topics....”2020
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6
Karlicek, Robert
2017
Table of Contents:
“...Introduction -- Conventional Light Sources -- Light Emitting Diodes (LEDs) -- OLEDS/PLEDS -- LED Driver Technology -- Conventional Sensor Systems -- Advanced Sensor Systems -- Sensor Integration and Control Methods -- Advanced Lighting Control Technology...”2017
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9
Alexe, Marin
2004
Table of Contents:
“...1 Direct Bonding, Fusion Bonding, Anodic Bonding, Wafer Bonding: A Historical Patent Picture of the Worldwide Moving Front of the State-of-the-Art of Contact Bonding -- 2 Basics of Silicon-on-Insulator (SOI) Technology -- 3 Silicon-on-Insulator...”2004
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10
Gaponenko, Sergey
2003
Table of Contents:
“... -- Optical spectroscopy of single silicon quantum dots -- Luminescence from Si/SiO2 nanostructures -- Electronic and dielectric properties of porous silicon -- Silicon technology used for size-controlled silicon nanocrystals -- Structural and optical properties...”2003
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12
Balestra, F.
2002
Table of Contents:
“...Innovation in material technologies -- Perspectives of SIMOX technology -- MBE growth of the top layer in Si/YSZ/Si structure -- SiCOI structures. Technology and characterization -- New SiC on insulator wafers based on the Smart-Cut® approach...”2002
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13
Elwenspoek, Miko
2001
Table of Contents:
“... -- Temperature-Balance Micro Flow Sensor System Based on a Free Oscillating Differential Power Controller -- Technology for Spatial Light Modulators Based on Reflective Silicon Structures -- Building of a Highly Sensitive Two-Channel Integrated Optical Young...”2001
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14
Lü, L.
2001
Table of Contents:
“...1 Introduction -- 1.1 Overview of rapid prototyping and manufacturing -- 1.2 Laser-induced rapid prototyping -- 1.3 RP process characterization and modeling -- 1.4 RP technology trends -- 1.5 References -- 2 Fundamentals of Laser-lithography Processes...”2001
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15
Capper, Peter
2001
Table of Contents:
“..., Design, Technology and Performance -- References -- 6 Uncooled Microbolometer Infrared Sensor Arrays -- 6.1 Introduction -- 6.2 Fabrication of Arrays of Thermal Sensors -- 6.3 Micromachined Microbolometer Design and Fabrication -- 6.4 Temperature-Sensitive...”2001
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16
Grote, Norbert
2001
Table of Contents:
“... Technologies -- 8.4 Summary -- References -- 9 All-Optical Time-Division Multiplexing Technology -- 9.1 Role of All-Optical TDM Technology -- 9.2 Key Technologies for All-Optical TDM Systems -- 9.3 Demonstration of OTDM and OTDM/WDM Transmission -- References -- 10...”2001
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17
Buzaneva, Eugenia
2000
Table of Contents:
“...I. Fundamentals of Nano-Scale Science for Photonics applications -- Nanophotonics: nanoscale optical science and technology -- Three-dimensional nanostructures with electron and photon confinement -- Dielectric-polymer nanocomposite and thin film...”2000
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18
Hemment, Peter L. F.
2000
Table of Contents:
“...Section 1: Innovations in Materials Technologies -- 1.1 Invited “SMART-CUT® Technology: Basic Mechanisms and Applications” -- 1.2 Invited “Polish Stop Technology for Silicon on Silicide on Insulator Structures” -- 1.3 Invited “Homoepitaxy on Porous...”2000
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19
Harman, George
1998
Table of Contents:
“... The At-Temperature Mechanical Properties of Lead-Tin-Based Alloys -- 2.2 Flip Chip Technology: Is It Time for Mass Production? -- 2.3 Flip-Chip - The Ultimate Solution Comparing Flip-Chip and Chip Scale Packaging (Abstract only) -- 2.4 Solder and Solderless Flip Chip...”1998
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20
Schropp, Ruud E. I.
1998
Table of Contents:
“...I Technology of Amorphous and Microcrystalline Silicon Solar Cells -- 1. Introduction -- 2. Deposition of Amorphous and Microcrystalline Silicon -- 3. Optical, Electronic and Structural Properties -- 4. Technology of Solar Cells -- 5. Metastability -- II...”1998
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