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Mikroelektronik. 2. Herstellungsprozesse für integrierte Schaltungen /
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Modern semiconductor device physics /
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Sze, S. M.
1998
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Advances in imaging and electron physics. 102 /
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Handbook of semiconductor interconnection technology /
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Mikrostrukturierung von porösem Silicium für optische und optoelektronische Anwendungen /
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Ultraclean surface processing of silicon wafers : secrets of VLSI manufacturing /
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Techniques and industrial applications /
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Materials issues in vacuum microelectronics : symposium held April 13-16, 1998, San Francisco, California, USA : [MRS Symposium on Materials Issues inVacuum Microelectronics ] /
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Zhu, Wei
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Materials science in microelectronics. 2. The effects of structure on properties in thin films /
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Indo-German Workshop on Microelectronics. 2 : Suraj Kund, New Delhi, December, 7th - 8th, 1995 /
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Entwicklung und Anwendung piezoresistiver Brückenelemente als integrierte Sensoren für die Rasterkraftmikroskopie [E-Book] /
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Indo-German Workshop on Microelectronics. 2 : Suraj Kund, New Delhi, December, 7th - 8th, 1995 [E-Book] /
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Entwicklung und Charakterisierung vertikaler Silizium-Feldeffekttransistoren auf der Basis selektiver Epitaxie [E-Book] /
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Characterization and metrology for ULSI technology : 1998 international conference Gaithersburg, Maryland [23. - 27.] March 1998 : [the 1998 International Conference on Characterization and Metrology for ULSI Technology] /
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Low and high dielectric constant materials : materials science, processing and reliability issues : proceedings of the Second International Symposium [on Low and High Dielectric Constant Materials] /
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International Electron Devices Meeting. 1997 : Washington, DC, December 7-10, 1997 : EDM technical digest.
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Wire bonding in microelectronics : materials, processes, reliability, and yield /
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Gate dielectrics and MOS ULSls : principles, technologies and applications /
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The national technology roadmap for semiconductors /
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Chemical mechanical planarization of microelectronic materials /
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