61
Diffusion phenomena in thin films and microelectronic materials /
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Reliability physics 1988: symposium : Monterey, CA, 12.04.88-14.04.88.
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1988
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The physics of submicron semiconductor devices : NATO advanced study institute on physics of submicron semiconductor devices : San-Miniato, 10.07.83-23.07.83 /
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64
Tungsten and other refractory metals for VLSI applications. 3 : Workshop on tungsten and other refractory metals for vlsi applications. 1987: proceedings : Yorktown-Heights, NY, 07.10.87-09.10.87.
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MOS - Transistoren in selektiver Epitaxie.
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66
Advanced interconnection and contact schemes based on TiSi2 and CoSi2: relevant materials issues and technological implementation.
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International IEEE VLSI multilevel interconnection conference 0005: proceedings : Santa-Clara, CA, 13.06.88-14.06.88.
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1988
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Electronic packaging materials science. 0003: symposium : Fall meeting of the Materials Research Society. 1987 : Boston, MA, 30.11.87-04.12.87.
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Microstructural science for thin film metallisations in electronic applications : Microstructural science for thin film metallizations in electronic applications: topical symposium: proceedings : Annual meeting of the Minerals, Metals and Materials Society. 1988 : Phoenix, AZ, 26.01.88-27.01.88.
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70
Surface and colloid science in computer technology /
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71
Electronic packaging and corrosion in microelectronics : proceedings of ASM's Third Conference on Electronic Packaging: Materials and Processes & Corrosion in Microelectronics, Minneapolis, Minnesota, 28-30 April 1987 /
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72
Gettering and defect engineering in the semiconductor technology : International Autumn Meeting Gettering and Defect Engineering in the Semiconductor Technology. 0002: proceedings : GADEST. 1987 : Garzau, 11.10.87-17.10.87.
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73
Tungsten and other refractory metals for VLSI applications. 2 : Workshop on Tungsten and Other Refractory Metals for VLSI Application : 1986: proceedings : Palo-Alto, CA, 12.11.86-14.11.86.
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International School on Physical Problems in Microelectronics : 0005: proceedings : ISPPME. 1987 : Varna, 18.05.87-23.05.87.
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International IEEE VLSI multilevel interconnection conference 0004: proceedings : MIC 1987 : Santa-Clara, CA, 15.06.87-16.06.87.
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1987
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Symposium on Multilevel Metallization, Interconnection and Contact Technologies: proceedings : Meeting of the Electrochemical Society. 0169 : San-Diego, CA, 21.10.86-22.10.86.
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Electronic Packaging Conference. 0002 : Electronic Packaging Conference. 0001 : Bloomington, MN, Saint-Paul, MN, 29.10.1985-31.10.1985 ; 21.08.1984-23.08.1984 : Materials and processes. Proceedings of the 2nd, selected papers of the 1st conf.
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78
VLSI metallization.
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Symposium on materials issues in silicon integrated circuit processing : Palo-Alto, CA, 15.04.1986-18.04.1986.
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Tungsten and other refractory metals for VLSI applications. 1 : Workshop on tungsten and other refractory metals for VLSI applications. 1985: proceedings : Workshop on tungsten and other refractory metals for VLSI applications. 1984: proceedings : Albuquerque, NM, 07.10.85-09.10.85 ; 12.11.84-13.11.84.
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