2
3
Alexe, Marin
2004
Table of Contents:
“...1 Direct Bonding, Fusion Bonding, Anodic Bonding, Wafer Bonding: A Historical Patent Picture of the Worldwide Moving Front of the State-of-the-Art of Contact Bonding -- 2 Basics of Silicon-on-Insulator (SOI) Technology -- 3 Silicon-on-Insulator...”2004
Full text
9
10
11
14
15
Morán-López, J. L.
1993
Table of Contents:
“... -- Microalloyed Steels: New Alternatives for the Industry of Mexico -- Future Ferrous Technologies -- Advanced High Temperature Corrosion Sciences -- Engineering Materials: The Case of Polyelectrolyte Cements -- Advanced Textil Structural Composites -- Cracking...”1993
Full text
16
Bertoni, Henry L.
1993
Table of Contents:
“... -- Polarization Diverse Ultra-Wideband Antenna Technology -- Wideband Circularly Polarized Aperture-Coupled Microstrip Antennas -- Low Cross-Polar, Short-Pulse Radiation Characteristics of Printed Antennas Covered by a Polarization Grating -- Reflector Antennas...”1993
Full text
17
18
Požela, Juras
1993
Table of Contents:
“...1. High-Speed Transistor Parameters -- 2. Technological and Physical Limitations on Transistor Miniaturization -- 3. Maximum Drift Velocity in Semiconductors -- 4. Homojunction Field-Effect and Bipolar Transistors -- 5. Heterostructure Field-Effect...”1993
Full text
19
20
Thong, John T. L.
1993
Table of Contents:
“...Background to Electron Beam Testing Technology -- I -- 1. Introduction -- 2. Principles and Applications -- II -- 3. Essential Electron Optics -- 4. Electron Beam Interaction with Specimen -- 5. Electron Spectrometers and Voltage Measurements -- 6. High...”1993
Full text